Advanced Packaging and Heterogeneous Integration Workshop: Where Industry, Academia, and Innovation Meet
Advanced packaging and heterogeneous integration are rapidly becoming the defining challenge for next-generation microelectronics. This free one-day workshop brings together leading voices from UK industry, national facilities, innovation centres, and academia to provide a comprehensive view of where we are and what needs to happen next in the UK.
Laura O'Keefe
John Darlington
Ibrahim
Richard Cook