Advanced Packaging and Heterogeneous Integration Workshop on 10th June

Advanced Packaging and Heterogeneous Integration Workshop: Where Industry, Academia, and Innovation Meet

Advanced packaging and heterogeneous integration are rapidly becoming the defining challenge for next-generation microelectronics. This free one-day workshop brings together leading voices from UK industry, national facilities, innovation centres, and academia to provide a comprehensive view of where we are and what needs to happen next in the UK. 

Organised by CHIMES Co-I Ibrahim Sari and hosted by the UK Microsystems Network, this workshop will cover topics including:

• Semiconductor sustainability and low-carbon FlexIC technology
• Advanced packaging for scientific instruments
• Semiconductor quantum photonic devices
• Additive manufacturing of advanced packages
• Package reliability and failure analysis
• Power electronics and photonics
• The UK advanced packaging industry landscape
• The role of national centres, professional bodies, and innovation ecosystems

The event, taking place at the University of Southampton on the 10th of June, is free to attend but does require you to register.

More information can be found by clicking on the following link: https://microsystemsnetwork.org.uk/advanced-packaging-and-heterogeneous-integration-workshop/